A wafer fabrication assessment model based on clustering of IC failure patterns

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dc.contributor.authorRajhard, Mladen M.
dc.date.accessioned2025-05-29T03:11:42Z
dc.date.available2025-05-29T03:11:42Z
dc.date.issued1991
dc.identifier.doihttps://doi.org/10.7939/R3930P455
dc.language.isoen
dc.rightsThis thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for non-commercial purposes. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.
dc.subjectSemiconductor wafers--Design and construction
dc.subjectIntegrated circuits--Design and construction
dc.subjectIntegrated circuits--Reliability--Mathematical models
dc.titleA wafer fabrication assessment model based on clustering of IC failure patterns
dc.typehttp://purl.org/coar/resource_type/c_46ec
thesis.degree.grantorhttp://id.loc.gov/authorities/names/n79058482
thesis.degree.levelMaster's
thesis.degree.nameMaster of Science
ual.date.graduation1991
ual.departmentDepartment of Electrical Engineering
ual.jupiterAccesshttp://terms.library.ualberta.ca/public

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